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Nuvo-8240GC
Industrial-grade GPU computing Edge AI platform supporting dual NVIDIA® L4/T4/A2 and Intel® Xeon® E and 9th/ 8th-Gen Core™ processor
Introduction
Nuvo-8240GC is a rugged edge AI GPU computing platform designed specifically to support dual NVIDIA® L4/ T4/ A2 GPUs for advanced inference acceleration applications.
It features NVIDIA® multi-precision NVIDIA® Ada Lovelace Cores while offering tremendous GPU power up to 484 TFLOPS in FP16 and 970 TOPS in INT8 for emerging GPU-accelerated edge computing and advanced AI inference. In addition, Nuvo-8240GC is powered by Intel® Xeon® E or 9th/ 8th-Gen Core™ CPU up to 8-core/ 16-thread coupled with workstation-grade Intel® C246 chipset to support up to 128 GB ECC or non-ECC DDR4 memory.
The system incorporates one internal 2.5" SATA HDD/ SSD slot and one hot-swappable 2.5" tray for easy HDD/ SSD replacement. There is also an M.2 2280 socket for the ultimate PCIe NVMe SSD. Its front-accessible GbE and USB 3.1 Gen1/ Gen2 ports feature screw-lock mechanisms for secure cable connections. In addition to the dual x16 PCIe slots (8-lanes) for NVIDIA L4/ T4/ A2 installation, Nuvo-8240GC has other two x8 PCIe slots (4-lanes)for expansion cards to extend function sets, making it that much more flexible for specific applications such as data collection, analytics and communication.
- Supports dual NVIDIA® L4/ T4/ A2 GPU
- Supports Intel® Xeon® E or 9th/ 8th-Gen Core™ i7/ i5 LGA1151 CPU
- Up to 128GB ECC/ non-ECC DDR4 2133 (4x SODIMM)
- Two x8 (4-lanes), Gen3 PCIe slots for add-on cards
- 1x M.2 M key, 1x M.2 B key and 2x full-size mini-PCIe sockets
- 8~48V wide-range DC input with built-in ignition power control
- Proven thermal design for -25°C to 60°C rugged operation*
- Patented damping brackets* to withstand 3 Grms vibration
Specifications
| System Core | |
|---|---|
| Processor | Supporting Intel® Xeon® E and 9th/ 8th-Gen CPU (LGA1151 socket) - Xeon E 2176G (6C/12T) / 2278GE (8C/16T) / 2278GEL (8C/16T) - i7-9700E, i7-9700TE, i7-8700, i7-8700T - i5-9500E, i5-9500TE, i5-8500, i5-8500T - i3-9100E, i3-9100TE, i3-8100, i3-8100T |
| Chipset | Intel® C246 Platform Controller Hub |
| Graphics | Integrated Intel® UHD Graphics 630 |
| Memory | Up to 128 GB ECC/ non-ECC DDR4 2133 SDRAM (four SODIMM slots) |
| AMT | Supports AMT 12.0 |
| TPM | Supports TPM 2.0 |
| I/O Interface | |
|---|---|
| Ethernet | 1x Gigabit Ethernet port by Intel I219-LM 1x Gigabit Ethernet port by Intel I210-IT |
| Video Port | 1x VGA, supporting 1920 x 1200 resolution 1x DVI-D, supporting 1920 x 1200 resolution 1x DisplayPort, supporting 4096 x 2304 resolution |
| Serial Port | 2x software-programmable RS-232/ 422/ 485 ports (COM1/COM2) |
| USB 3.1 | 4x USB 3.1 Gen2 (10 Gbps) ports 4x USB 3.1 Gen1 (5 Gbps) ports |
| USB 2.0 | 1x USB 2.0 ports (internal for dongle use) |
| Audio | 1x 3.5 mm jack for mic-in and speaker-out |
| Storage Interface | |
|---|---|
| SATA | 1x hot-swappable HDD tray for 2.5" HDD/ SSD installation 1x Internal SATA port for 2.5" HDD/ SSD installation, supporting RAID 0/1 |
| M.2 | 1x M.2 2280 M key socket (PCIe Gen3 x4) for NVMe SSD or Intel® Optane™ memory installation |
| mSATA | 2x full-size mSATA port (mux with mini-PCIe) |
| Expansion Bus | |
|---|---|
| PCI Express | 2x PCIe x16 slot@Gen3, 8-lanes 2x PCIe x8 slots@Gen3, 4-lanes |
| M.2 | 1x M.2 2242 B key socket supporting dual SIM mode with selected M.2 LTE module |
| mini-PCIe | 2x full-size mini PCI Express socket |
| Power Supply | |
|---|---|
| DC Input | 1x 4-pin pluggable terminal block for 8~48V DC input with ignition control |
| Mechanical | |
|---|---|
| Dimension | 190 mm (W) x 271 mm (D) x 198.5 mm (H) |
| Weight | 5 kg |
| Mounting | Wall-mount with damping brackets |
| Environmental | |
|---|---|
| Operating Temperature | with 35W CPU -25°C ~ 60°C *** with 65W CPU -25°C ~ 60°C **/ *** (configured as 35W TDP mode) -25°C ~ 50°C **/ *** (configured as 65W TDP mode) In compliance with NVIDIA® L4/ T4/ A2 warranty policy, an operating temperature of 0°C~50°C is required for systems with L4/ T4/ A2 installed |
| Storage Temperature | -40°C ~ 85°C |
| Humidity | 10%~90% , non-condensing |
| Vibration | Operating, MIL-STD-810G, Method 514.6, Category 4 & 3Grms |
| Shock | Operating, MIL-STD-810G, Method 516.6, Procedure I,Table 516.6-II |
| EMC | CE/FCC Class A, according to EN 55032 & EN 55024 |
