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Nuvo-5095GC

Nuvo-5095GC

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Compact and wide-temperature GPU Computing platform supporting 75W nVidia® GPU & Intel® 6th-Gen Core™ processor

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Introduction

Nuvo-5095GC opens a new chapter for industrial computers. As the first embedded controller targeted at emerging applications of CUDA computing, Autonomous, Edge AI inference and virtual reality, Nuvo-5095GC has all the features required for a compact, reliable and powerful edge AI GPU computing platform.

Supporting 75W nVidia® GPU, Nuvo-5095GC possesses 768 CUDA cores to deliver tremendous computing power for arithmetic/graphics operations. Neousys' patented Cassette technology and an innovative thermal design help to effectively dissipate heat generated by the GPU, thus making this compact system capable of operating reliably at 60°C under 100% GPU load.

Nuvo-5095GC is based on Intel® Skylake platform, supporting 35W/65W 6th-Gen ® Core™ processors and up to 32GB of DDR4 memory. It offers rich I/O functions, such as GbE, USB 3.1 Gen1 and COM ports to connect to external devices. All these features are integrated into a compact, 240 x 225 x 110 mm footprint. For fast-growing GPU-computing applications, Nuvo-5095GC presents the first industrial-grade, compact and rugged platform incorporating CPU and GPU to offer performances far beyond traditional industrial computers.

  • Supports nVidia® GPU with up to 75W TDP
  • Patented thermal design to allow -25°C to 60°C wide temperature range operation
  • Supports 6th-Gen Intel® Core™ i7/i5 LGA1151 CPU
  • 6x Gigabit Ethenet ports
  • Supports 9.5 kB jumbo frame
  • Up to 32 GB, DDR4-2133 SODIMM
  • 240 mm x 225 mm x 111 mm compact footprint
  • Compatible with MezIO™ interface for function expansion
  • Accommodates two 2.5" SATA HDD/SSD with RAID 0/1 support
  • Patented ventilation hole* for graphic card
Innovative System Design

Nuvo-5095GC leverages Neousys' patented Cassette to avoid thermal interference between CPU and GPU compartment. A patented mechanical design that creates a sealed, separated tunnel for air intake to GPU.

Specifications

System Core
Processor Supports 6th-Gen Intel® Core™ LGA1151 CPU
- Intel® Core™ i7-6700 (8M Cache,3.4/4.0 GHz, 65W TDP)
- Intel® Core™ i5-6500 (6M Cache, 3.2/3.6 GHz, 65W TDP)
- Intel® Core™ i7-6700TE (8M Cache, 2.4/3.4 GHz, 35W TDP)
- Intel® Core™ i5-6500TE (6M Cache, 2.3/3.3 GHz, 35W TDP)
Chipset Intel® Q170 Platform Controller Hub
Graphics Independent nVidia® GPU (75W TDP) or Integrated Intel® HD 530/510 Controller
Memory Up to 32 GB DDR4-2133 SDRAM (dual SO-DIMM sockets)
AMT Supports AMT 11.0
TPM Supports TPM 2.0
I/O Interface
Ethernet 6x Gigabit Ethernet ports, one via Intel® I219 and five via I210
PoE+ Optional IEEE 802.3at PoE+ PSE for GbE Port 3 ~ Port 6, 80 W total power budget
USB 4x USB 3.1 Gen1 ports via native XHCI controller
4x USB 2.0 ports
Video Port
(Integrated Graphics)
1x stacked VGA + DVI-D connector
2x DisplayPort connectors, supporting 4K2K resolution
Serial Port 2x software-programmable RS-232/422/485 port (COM1 & COM3)
1x RS-232 port (COM2)
Audio 1x Mic-in and 1x Speaker-out
Storage Interface
SATA HDD 2x internal SATA port fors 2.5" HDD/SSD installation, supporting RAID 0/1
mSATA 1x full-size mSATA port (mux with mini-PCIe)
Expansion Bus
Mini PCI-E 1x internal mini PCI Express socket with front-accessible SIM socket
1x internal mini PCI Express socket with internal SIM socket (mux with mSATA)
Expandable I/O 1x MezIO™ expansion port for Neousys' MezIO™ modules
Power Supply
DC Input 1x 3-pin pluggable terminal block for 8V to 35V DC input
Remote Ctrl. &
Status Output
1x 10-pin (2x5) wafer connector for remote on/off control and status LED output
Mechanical
Dimension 240 mm (W) x 225 mm (D) x 111 mm (H)
Weight 4.8 kg (including CPU, GPU, memory and HDD)
Mounting Wall-mount by mounting bracket
Environmental
Operating Temperature with i7-6700TE, i5-6500TE (35W TDP)
-25°C ~ 60°C **
with i7-6700, i5-6500 (65W TDP)
-25°C ~ 60°C **/*** (configured as 35W CPU mode)
-25°C ~ 50°C **/*** (configured as 65W CPU mode)
Storage Temperature -40°C ~ 85°C
Humidity 10%~90% , non-condensing
Vibration Operating, 5 Grms, 5-500 Hz, 3 Axes
(w/ SSD, according to IEC60068-2-64)
Shock Operating, 50 Grms, Half-sine 11 ms Duration
(w/ SSD, according to IEC60068-2-27)
EMC CE/ FCC Class A, according to EN 55022, EN 55024 & EN 55032

** The high operating temperature specified here is defined under the condition of 100% GPU loading applied using TessMark x64 GPU stress test. For detail testing criteria, please contact Neousys Technology
***For sub-zero operating temperature, a wide temperature range HDD drive or Solid State Disk (SSD) is required.

 



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